Dispenser
Equipment Introduction:
This device is used for adhesive appearance inspection and adhesive size measurement in the fields of PCB and chip packaging.
Technical Conditions:
Equipment size: L1100 * W555 * H1550
Testing items: broken glue, glue width, glue opening size, presence or absence of glue in the capacitor area, distance from the glue to the substrate edge, foreign objects in the glue, dirt and stains in the glue, glue crawling, proportion of TIM glue on the glue, and damage to the glue.
Applicable product size: 160mm * 80mm
Measurement accuracy: 0.04mm
Measurement speed: 20S/PCS
Testing method: CCD image automatic processing
This device is used for adhesive appearance inspection and adhesive size measurement in the fields of PCB and chip packaging.
Technical Conditions:
Equipment size: L1100 * W555 * H1550
Testing items: broken glue, glue width, glue opening size, presence or absence of glue in the capacitor area, distance from the glue to the substrate edge, foreign objects in the glue, dirt and stains in the glue, glue crawling, proportion of TIM glue on the glue, and damage to the glue.
Applicable product size: 160mm * 80mm
Measurement accuracy: 0.04mm
Measurement speed: 20S/PCS
Testing method: CCD image automatic processing